Build-up substrate
Mounting of narrow-pitch electronic components due to the build-up structure! Compatible with chip-on-hole.
We would like to introduce our "Build-Up Boards." We can accommodate layer counts from 4 to 16 layers, and the VIA structure can support various interlayer connections through laser or drill processing. Additionally, we can handle narrow pitch BGA/CSP mounting, impedance control, and a variety of substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 to 16 layers ■ VIA structure: Supports various interlayer connections through laser or drill processing ■ Compatible with narrow pitch BGA/CSP mounting ■ Supports impedance control ■ Accommodates various substrate materials for different applications ■ Chip-on-hole compatible *For more details, please refer to the PDF document or feel free to contact us.
- Company：三和電子サーキット
- Price：Other
